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It is our great pleasure to announce that the 19th International Symposium on Microelectronics and Packaging (ISMP cor2021) will be held as hybrid meeting (both onsite face-to-face and online sessions) at Haeundae Hanwha Resort, Busan, Korea, on November 3(Wed.)-5(Fri.), 2021. The ISMP 2021, organized by KMEPS (the Korean Microelectronics and Packaging Society), presents a valuable chance to share the latest electronic packaging technologies with other professionals as well as to boost communication and collaboration with colleagues around the world. The ISMP 2021 organizing committee promises to provide an outstanding and fruitful program, which will be a great opportunity that you do not miss. Also, ISMP 2021 inaugurates special symposium in memory and in recognition of the scientific contributions of Professor Kyung W. Paik. We cordially invite you to submit abstracts for oral and poster presentation. We look forward to meeting you at ISMP 2021 in November.

Plenary Speakers
Dr. Yun Tae Lee, Former CEO
Samsung Electro-Mechanics Co., Ltd., Korea
“Semiconductor Industry Savior:
Further Acceleration in Package Innovation”

Prof. Joungho Kim
KAIST(Korea Advanced Institute of Science and Technology), Korea
“Next Generation Terabyte/s HBM (High-bandwidth Memory Module) Designs for Advanced Artificial Intelligence (AI) Servers” Biography
Keynote Speakers
Prof. Bongtae Han
University of Maryland, USA
“Warpage after molding processes: Can we really predict this?” Biography

Dr. Santosh KUMAR
Yole Dévelopement, France
“Advanced Packaging Technology & Materials trends” Biography
Invited Speakers
[Heterogeneous Integration Roadmap (HIR) Workshop 1]
  • 1. Dr. Bill Chen & Dr. W. R. “Bill” Bottoms*
    ASE Technology Holding, Co., Ltd., USA
    Third Millennium Test Solutions Inc.(3MTS)*, USA
    “HIR workshop-International: HIR Overview”
  • 2. Sir. Timothy Lee
    “HIR workshop-International: 5G Communication”
  • 3. Sir. Rich Rice
    ASE Technology Holding, Co., Ltd., USA
    “HIR workshop-International: Automotive Electronics”
  • 4. Prof. Jose E Schutt-Aine
    University OF Illinois Urbana-Champaign, USA
    “HIR workshop-International: Co-Design”
[Heterogeneous Integration Roadmap (HIR) Workshop 2]
  • 1. Dr. Kyuoh Lee
    Intel Corporation, USA
    “Substrate Roadmap for Heterogenous Integration”
  • 2. Dr. Max Min
    Ex. Samsung Foundry, USA
    “CUBE and ISC Technologies for 2.5D and 3D Heterogeneous Integration”
  • 3. Sir. PilJe Sung
    Amkor Technology Korea, Korea
    “Heterogeneous 2.5D Integration Packaging Technology”
  • 4. Sir. Insoo Kang
    NEPES Corporation, Korea
    “Highly-integration Packaging Technologies for 5G, HPC & Automotive Applications”
[Microelectronics & Packaging Materials 1]
  • 1. Prof. Hyejin Jang
    Seoul National University, Korea
    “Thermal management at nanoscale in electronics packaging”
  • 2. Prof. Seung-Kyun Kang
    Seoul National University, Korea
    “Transient Packaging Strategies for Biodegradable Electronics”
  • 3. Dr. Chukwudi Okoro
    Corning Incorporated, USA
    “Achieving Crack-Free Metallized Through-Glass Via Substrate for Reliable High Frequency Microelectronic Packages”’
  • 4. Dr. Sang Mok Lee
    CNNT, Co. Ltd., Korea
    “Low Dielectric, High Crystalline, Natural Nano Fiber, as Packaging Materials”
[Packaging Processing & Equipment]
  • 1. Dr. Donghyun Kim
    Hana Micron Inc., Korea
    ““Emerging Semiconductor Packaging Technologies”
  • 2. Dr. Heejin Lee
    SK hynix Inc., Korea
    “The future of memory package technology”
  • 3. Sir. Jun Sang Park
    Protec Co., Ltd., Korea
    “Proposal of Micro UF(Underfill) & SBA (Solder ball attach) for Advanced Package”
  • 4. Sir. SeongJin Park
    ASM Pacific, Korea
    “Advanced Packaging Interconnect Solutions”
[PCB, Solder and Reliability]
  • 1. Dr. Sung-Bin Kim
    AnyCasting Co., Ltd., Korea
    “How to Apply Selective Electrochemical 3D Printer to the Additive Process of Thermal Resistant Bonding Materials for High-Power Semiconductors in the PCB Mass Production?”
  • 2. Prof. Shuye Zhang
    Harbin Institute of Technology, China
    “Effects of Co on the Morphology, Shear Strength and Fracture of the Low Temperature SAC305/Sn-58Bi/Cu Composite Solder Joint”
  • 1. ‪Dr. Hanchul Cho
    KITECH (Korea Institute of Industrial Technology), Korea‬‬
    “Flexible Pressure Sensor Based on 3D Structure and its Application”
  • 2. Prof. Jihyun Kim
    Korea University, Korea
    “Ultra-Wide Bandgap Ga2O3-Based Solar-Blind Photodetectors”
  • 3. Prof. Il Kwon Oh
    KAIST (Korea Advanced Institute of Science and Technology), Korea
    “Soft Ionic Transducers based on Nanomaterials”
[Flexible/ Wearable Electronics 1]
  • 1. Prof. W. Hong Yeo
    Georgia Tech, USA
    “Intelligent Soft Bioelectronics for Advancing Human Healthcare”
  • 2. Prof. Nanshu Lu
    University of Texas Austin, USA
    “Soft Electronics for Mobile Health and Human-Centered Robotics”
  • 3. Prof. Hyun-Joong Chung
    University of Alberta, Canada
    “Sensors and Medical Devices based on Textiles and Elastomers”
  • 4. Prof. Xian Huang
    Tianjin university, China
    “Printing and Water Sintering Techniques for High Performance Transient Electronic Circuits”
[Flexible/ Wearable Electronics 2]
  • 1. Prof. Sungjune Jung
    POSTECH (Pohang University of Science and Technology), Korea
    “Flexible and Printed 3D Organic Circuits and Active-Matrix Sensor Arrays”
  • 2. Prof. Jang-Ung Park
    Yonsei University, Korea
    “High-Resolution 3D Printing of Stretchable Interconnections for Wearable Electronics”
  • 3. Prof. Yei-Hwan Jung
    Hanyang University, Korea
    “Skin-Integrated Wireless Haptic Interface for VR and AR”
[Automotive Electronics and High Power Package]
  • 1 Dr. Siow Kim Shyong
    Universiti Kebangsaan Malaysia, Malaysia
    “Sintered Silver as Die Attach Materials”
  • 2. Prof. Sang Won Yoon
    Hanyang University, Korea
    “Power Semiconductor Packaging Approaches for Reliable Power Module Systems”
  • 3. Sir. HyeongIl Jeon
    Amkor Technology Korea, Korea
    “Complete EMI Shielding Leadless Package Solution in Automotive”
Special Session for Honor Retirement of Professor Kyung W. Paik
  • 1. Dr. Kiwon Lee
    Ybrain Inc., Korea
    “Electroceuticals: The Future of Miniaturized Medical Devices”
  • 2. Dr. Min Hyung Lee
    KITECH (Korea Institute of Industrial Technology), Korea
    “Development of SmartPlateTM Series: Superb Copper Electroplating Solution for Overcoming Process Limitations of Micro-Bump”
  • 3. Dr. Kim Hyoung Joon
    Qualcomm Technologies, Inc., Korea
    “Packaging Trend & FOWLP Development”
  • 4. Dr. Ho-Young Son
    SK hynix Inc., Korea
    “Interconnect Challenges in Memory Packaging”
  • 5. Dr. DalJin Yoon
    SK hynix Inc., Korea
    “Effects of Magnetic Field on the Dispersion of Conductive Particles in Anchoring Polymer Layer (APL) Anisotropic Conductive Films (ACFs) for Ultra-Fine Pitch Interconnection”
Symposium Topics

ISMP 2021 will include all basic/applied sciences and technologies in the fields of electronic materials, devices, and packaging. Topics may include, but are not limited to, the following areas:

  • Novel Packaging Technologies for AI, IoT, and Big data
  • Packaging Solutions for 5G/6G Applications
  • System Integration with Advanced Packaging Technologies
  • Electronic Materials for Interconnects and Packaging
  • Emerging Process for Interconnects and Packaging
  • PCB, Solder, and Assembly Process
  • Automotive & Power Electronic Packaging
  • Sensors, LED, and Emerging Packaging Technology
  • Flexible, Wearable, and Printed Electronics
  • MEMS/NEMS Packaging and Applications
  • Reliability of Electronic Devices and Systems
  • Design Tools and Modeling
What’s New
Title Date
Recruitment Booth