Welcome Message

Sayoon Kang
General Chair
It is our great pleasure to announce that the 19th International Symposium on Microelectronics and Packaging (ISMP 2021) will be held as hybrid meeting (both onsite face-to-face and online sessions) at Hanwha Resort, Busan, Korea, on November 3rd (Wed.) ~ 5th (Fri.), 2021. The ISMP 2021, organized by KMEPS (the Korean Microelectronics and Packaging Society), presents a valuable chance to share the latest electronic packaging technologies with other professionals as well as to boost communication and collaboration with colleagues around the world. Especially, valuable presentations about HIR (Heterogeneous Integration Roadmap) will be prepared. Also, special symposium honoring Professor Kyung W. Paik on his retirement is planned. The ISMP 2021 organizing committee promises to provide an outstanding and fruitful program, which will be a great opportunity that you do not miss. We cordially invite you to submit abstracts for oral and poster presentation. We look forward to meeting you at ISMP 2021 in Busan, Korea on November 3 ~ 5th.