| Nov. 3, 2021 (Wed.) | ||
|---|---|---|
| 19:00-20:30 | Welcome Reception | |
| Nov. 4, 2021 (Thu.) | ||
| Room Monterosso, B1F Session Chair: Tae-Ik Lee (Korea Institute of Industrial Technology/ Korea) |
Room Forum 1, 3F Session Chair: Sungwook Mhin (Kyonggi University/ Korea) |
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| A1. Automotive Electronics and High Power Package | B1. Sensor | |
| 08:30-08:55 | O1-1 Synthesis of Crystalline Pure Mesoporous TiO2B and its Application on Environmental Pollutants Degradation Dr. Md Kamal Hossain (Bangladesh Council of Scientific and Industrial Research/ Bangladesh) |
O1-2 Manganese and Nitrogen Doped Graphene Oxide-Based Hybrid Composite Materials for DMMP Detection Mr. Sanjeeb Lama, Dr. Sivalingam Ramesh*, Dr. Young-Jun Lee, Mr. Bong-Gyu Bae, Mr. Jae-Hong Kim, Prof. Joo-Hyung Kim (Dongguk University*, Inha University/ Korea) |
| 08:55-09:20 | O1-3 Ultrafast Sinter-Bonding Technique in Air Using Size-Controllable Cu Dendritic Particles Dr. Eun Byeol Choi, Prof. Jong-Hyun Lee (Seoul National University of Science and Technology/ Korea) |
O1-4 Mesoporous Pd@Au Film Integrated with Blood Plasma Separation Membrane for Surface-Enhanced Raman Scattering (SERS) Biosensor Dr. Hyun-Jong Kim, Ms. Hana Lim, Dr. Young Min Park, Dr. Ho-Nyun Lee (KITECH/ Korea) |
| 09:20-09:45 | (Invited) I1-1 Sintered Silver as Die Attach Materials Dr. Siow Kim Shyong (Universiti Kebangsaan Malaysia/ Malaysia) |
(Invited) I1-2 Flexible Pressure Sensor Based on 3D Structure and its Application Dr. Hanchul Cho (KITECH/ Korea) |
| 09:45-10:10 | (Invited) I1-3 Power Semiconductor Packaging Approaches for Reliable Power Module Systems Prof. Sang Won Yoon (Hanyang University/ Korea) |
(Invited) I1-4 Ultra-Wide Bandgap Ga2O3-Based Solar-Blind Photodetectors Prof. Jihyun Kim (Korea University/ Korea) |
| 10:10-10:35 | (Invited) I1-5 Complete EMI Shielding Leadless Package Solution in Automotive Sir. HyeongIl Jeon (Amkor Technology Korea/ Korea) |
(Invited) I1-6 Soft Ionic Transducers based on Nanomaterials Prof. Il Kwon Oh (KAIST/ Korea) |
| 10:35-10:55 | Coffee break | |
| Room Monterosso, B1F Session Chair: Sungdong Kim (Seoul National University of Science and Technology/ Korea) |
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| 10:55-11:05 | Opening Remark | |
| 11:05-11:35 | Keynote Talk 1 Warpage after Molding Processes: Can we Really Predict This? Prof. Bongtae Han (University of Maryland/ USA) |
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| 11:35-12:05 | Keynote Talk 2 Advanced Packaging Technology & Materials trends Dr. Santosh Kumar (Yole Dévelopement/ France) |
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| 12:05-13:20 | Lunch | |
| Room Monterosso, B1F Session Chair: Sayoon Kang (The Korean Microelectronics and Packaging Society/ Korea) |
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| 13:20-13:50 | Plenary Talk 1 Semiconductor Industry Savior: Further Acceleration in Package Innovation Dr. Yun Tae Lee (Samsung Electro-Mechanics Co., Ltd./ Korea) |
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| 13:50-14:20 | Plenary Talk 2 Next Generation Terabyte/s HBM (High-bandwidth Memory Module) Designs for Advanced Artificial Intelligence (AI) Servers Prof. Joungho Kim (Korea Advanced Institute of Science and Technology/ Korea) |
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| 14:20-14:40 | Coffee break | |
| Room Forum 2 & Forum 3, 3F Session Chair: Young-Bae Park (Andong National University/ Korea) & Yong-Ho Ko (Korea Institute of Industrial Technology) |
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| 14:40-15:20 | Poster Presentation Session | |
| Room Monterosso, B1F Session Chair: Ho-Young Son (SK hynix Inc./ Korea) |
Room Forum 1, 3F Session Chair: Jeong-Won Yoon (Chungbuk National University/ Korea) |
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| A2. Special Session for Honor Retirement of Professor Kyung W. Paik | B2. Microelectronics & Packaging Materials 1 | |
| 15:20-15:45 | S1-1 I1-7 Electroceuticals: The Future of Miniaturized Medical Devices Dr. Kiwon Lee (Ybrain Inc./ Korea) |
I1-7 Thermal Management at Nanoscale in Electronics Packaging Prof. Hyejin Jang (Seoul National University/ Korea) |
| 15:45-16:10 | S1-2 Development of SmartPlateTM Series: Superb Copper Electroplating Solution for Overcoming Process Limitations of Micro-Bump Dr. Min Hyung Lee (KITECH/ Korea) |
I1-8 Transient Packaging Strategies for Biodegradable Electronics Prof. Seung-Kyun Kang (Seoul National University/ Korea) |
| 16:10-16:35 | S1-3 Packaging Trend & FOWLP Development Dr. Kim Hyoung Joon (Qualcomm Technologies, Inc./ Korea) |
I1-9 Achieving Crack-Free Metallized Through-Glass Via Substrate for Reliable High Frequency Microelectronic Packages Dr. Chukwudi Okoro (Corning Incorporated/ USA) |
| 16:35-17:00 | S1-4 Interconnect Challenges in Memory Packaging Dr. Ho-Young Son (SK hynix Inc./ Korea) |
(Invited) I1-10 Low Dielectric, High Crystalline, Natural Nano Fiber, as Packaging Materials Dr. Sang Mok Lee (CNNT, Co. Ltd./ Korea) |
| 17:00-17:25 | S1-5 Effects of Magnetic Field on the Dispersion of Conductive Particles in Anchoring Polymer Layer (APL) Anisotropic Conductive Films (ACFs) for Ultra-Fine Pitch Interconnection Dr. DalJin Yoon (SK hynix Inc./ Korea) |
O1-5 Novel Synthesis of Highly Periodic Mesoporous Organosilicas SMS-1 & SMS-2 and Application for Various Electronic Materials Dr. Md Kamal Hossain (Bangladesh Council of Scientific and Industrial Research/ Bangladesh) |
| Room Monterosso, B1F Session Chair: Sung-Hoon Choa (Seoul National University of Science and Technology/ Korea) |
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| 17:25-17:40 | Retirement Ceremony of Professor Kyung W. Paik | |
| 17:40~ | Dinner (Blue Seagull, 2F) | General Meeting (Room Monterosso, B1F) |
| Nov. 5, 2021 (Fri.) | ||
| Room Monterosso, B1F Session Chair: Gu-Sung Kim (Kangnam University/ Korea) |
Room Forum 1, 3F Session Chair: Tae-il Kim (Sungkyunkwan University/ Korea) |
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| C1. Heterogeneous Integration Roadmap (HIR) Workshop 1 | D1. Flexible/ Wearable Electronics 1 | |
| 08:30-08:55 | (Invited) I2-1 HIR Workshop-International: HIR Overview Dr. William Chen (ASE Technology Holding, Co., Ltd./ USA) Dr. W. R. "Bill" Bottoms (Third Millennium Test Solutions Inc.(3MTS)/ USA) |
I2-2 Intelligent Soft Bioelectronics for Advancing Human Healthcare Prof. W. Hong Yeo (Georgia Tech/ USA) |
| 08:55-09:20 | (Invited) I2-3 HIR Workshop-International: 5G Communication Sir. Timothy Lee (IEEE/ USA) |
(Invited) I2-4 Soft Electronics for Mobile Health and Human-Centered Robotics Prof. Nanshu Lu (University of Texas Austin/ USA) |
| 09:20-09:45 | (Invited) I2-5 HIR Workshop-International: Automotive Electronics Sir. Rich Rice (ASE Technology Holding, Co., Ltd./ USA) |
(Invited) I2-6 Sensors and Medical Devices Based on Textiles and Elastomers Prof. Hyun-Joong Chung (University of Alberta/ Canada) |
| 09:45-10:10 | (Invited) I2-7 HIR Workshop-International: Co-Design Prof. Jose E Schutt-Aine (University OF Illinois Urbana-Champaign/ USA) |
(Invited) I2-8 Printing and Water Sintering Techniques for High Performance Transient Electronic Circuits Prof. Xian Huang (Tianjin university/ China) |
| 10:10-10:30 | Coffee break | |
| Room Monterosso, B1F Session Chair: Taek-Soo Kim (Korea Advanced Institute of Science and Technology/ Korea) |
Room Forum 1, 3F Session Chair: Suck Won Hong (Pusan National University/ Korea) |
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| C2. Heterogeneous Integration Roadmap (HIR) Workshop 2 | D2. Flexible/ Wearable Electronics 2 | |
| 10:30-10:55 | (Invited) I2-9 Substrate Roadmap for Heterogenous Integration Dr. Kyuoh Lee (Intel Corporation/ USA) |
(Invited) I2-10 Flexible and Printed 3D Organic Circuits and Active-Matrix Sensor Arrays Prof. Sungjune Jung (POSTECH/ Korea) |
| 10:55-11:20 | (Invited) I2-11 CUBE and ISC Technologies for 2.5D and 3D Heterogeneous Integration Dr. Max Min (Ex. Samsung Foundry, USA) |
(Invited) I2-12 High-Resolution 3D Printing of Stretchable Interconnections for Wearable Electronics Prof. Jang-Ung Park (Yonsei University/ Korea) |
| 11:20-11:45 | (Invited) I2-13 Heterogeneous 2.5D Integration Packaging Technology Sir. PilJe Sung (Amkor Technology Korea/ Korea) |
(Invited) I2-14 Skin-Integrated Wireless Haptic Interface for VR and AR Porf. Yei-Hwan Jung (Hanyang University/ Korea) |
| 11:45-12:10 | (Invited) I2-15 Highly-integration Packaging Technologies for Various Applications Sir. Insoo Kang (NEPES Corporation/ Korea) |
O2-1 Effect of cyclic Frequency on Bending Fatigue in Copper Film on Flexible Substrate Mr. Lee Jong-Sung, Dr. Young-Joo Lee*, Prof. Byoung-Joon Kim**, Prof. Young-Chang Joo (Seoul National University, Korea Polytechnic University**/ Korea, University of Pennsylvania*/ USA) |
| 12:10-13:30 | Lunch | |
| Room Monterosso, B1F Session Chair: Yohan Yoon (Korea Aerospace University/ Korea) |
Room Forum 1, 3F Session Chair: Yoonchul Sohn (Chosun University/ Korea) |
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| C3. Packaging Processing & Equipment | D3. PCB, Solder and Reliability | |
| 13:30-13:55 | (Invited) I2-16 Emerging Semiconductor Packaging Technologies Dr. Donghyun Kim (Hana Micron Inc./ Korea) |
(Invited) I2-17 How to Apply Selective Electrochemical 3D Printer to the Additive Process of Thermal Resistant Bonding Materials for High-Power Semiconductors in the PCB Mass Production? Dr. Sung-Bin Kim (AnyCasting Co., Ltd./ Korea) |
| 13:55-14:20 | (Invited) I2-18 The Future of Memory Package Technology Dr. Heejin Lee (SK hynix Inc./ Korea) |
(Invited) I2-19 Effects of Co on the Morphology, Shear Strength and Fracture of the Low Temperature SAC305/Sn-58Bi/Cu Composite Solder Joint Prof. Shuye Zhang (Harbin Institute of Technology/ China) |
| 14:20-14:45 | (Invited) I2-20 Proposal of Micro UF(Underfill) & SBA (Solder ball attach) for Advanced Package Sir. Jun Sang Park (Protec Co., Ltd./ Korea) |
O2-2 Study of Sn-Bi-In Ternary Solders for Solder from Eutectic Point to 79℃ Ternary Eutectic Mr. Hoon Choi, Mr. Sung-Ryul Mang, Prof. Hoo-Jeong Lee (Sungkyunkwan University/ Korea) |
| 14:45-15:10 | (Invited) I2-21 Advanced Packaging Interconnect Solutions Sir. SeongJin Park (ASM Pacific/ Korea) |
O2-3 2-Layer Rt-QFN : a New Coreless Substrate Based on Lead-Frame Technology Dr. In Seob Bae, Mr. Hong Chan Kim, Mr. Ho Jun Ryu, Mr. Sung Il Kang (HaesungDS/ Korea) |
| 15:10-15:35 | O2-4 ffects of N2 Plasma Treatment Condition on the Interfacial Adhesion Energy of Polybenzoxazole/Cu Layer for Cu RDL Applications of FOWLP Ms. Gahui Kim, Mr. Doheon Kim, Prof. Young-Bae Park (Andong National University/ Korea) |
O2-5 Investigation on the Mechanical Reliability of TiN / SiO2 for W Nucleation Processes Mr. Sun Woo Lee*, Mr. Dong Jun Kim*, Dr. Jinho Jeon, Dr. WonJun Yun, Dr. Tae-Sung Kim, Prof. Taek-Soo Kim* (WONIK IPS CO., Ltd., KAIST*/ Korea) |
| 15:35-15:55 | Coffee break | |
| Room Monterosso, B1F Session Chair: Hyunsik Yoon (Seoul National University of Science and Technology/ Korea) |
Room Forum 1, 3F Session Chair: Min-Su Kim (Korea Institute of Industrial Technology/ Korea) |
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| C4. Microelectronics & Packaging Materials 2 | D4. Interconnection | |
| 15:55-16:20 | O2-6 Face and Phase Engineered TiO2 and MoS2 Nanocomposites Toward Efficient Photocatalytic H2 Evolution and its Potential as a Nydrogen Sensor Prof. Hyuksu Han (Konkuk University/ Korea) |
O2-7 Bonding with Partially Cured Low Temperature Polyimide (National Yang Ming Chiao Tung University/ Taiwan) |
| 16:20-16:45 | O2-8 Investigation of Photovoltaic Devices Monitoring Technologies Mr. Shuo Ni, Dr. Jihyun Kim, Prof. Joo-Hyung Kim (Inha University/ Korea) |
O2-9 Development of Simultaneous Transfer and Bonding (SITRAB) Process for Micro/Mini LED Arrays Using Anisotropic SITRAB Paste (ASP) and Laser-Assisted Bonding (LAB) Technology Dr. Jiho Joo, Dr. Yong-Sung Eom, Ms. Chanmi Lee, Dr. Gwang-Mun Choi, Mr. Ki-seok Jang, Mr. In-Seok Kye, Dr. Seok Hwan Moon, Dr. Ho-Gyeong Yun, Dr. Kwang-Seong Choi (ETRI/ Korea) |
| 16:45-17:10 | O2-10 Thermal Stress Analysis of Warpage Behavior according to Application of Thermal Insulation Materials Mr. Kyeong-ho Shin, Mr. Sanglok Park, Ms. HyeonJung Kwon, Mr. Hyoungsub Shim, Prof. Joo-Hyung Kim (Inha University/ Korea) |
O2-11 Analysis of Ar/N2 Two-step Plasma Activated Cu Surface for Low-Temperature Cu–Cu Direct Bonding Characteristics Mr. Seonghun Choi, Ms. Gahui Kim, Prof. Sarah Eunkyung Kim*, Prof. Young-Bae Park (Seoul National University of Science and Technology*, Andong National University/ Korea) |
| 17:10-17:35 | O2-12 Robust and Flexible Bonding of Carbon Nanotube Adhesion Layer between Polymer Substrates via Microwave Irradiation Ms. Minjeong Sohn, Dr. Min-Su Kim, Prof. Byeong-Kwon Ju*, Dr. Tae-Ik Lee (Korea University*, KITECH/ Korea) |
O2-13 High Speed and Low-Pressure Sinter-Bonding Properties of Surface-Treated Bimodal Cu Particles for Die-Attachment Mr. Doyeop Namgoong, Prof. Jonh-Hyun Lee (Seoul National University of Science and Technology/ Korea) |
| 17:35-18:00 | O2-14 Using MooN IEC 61508 Functional Safety Architecture in Throughput Logic Critical Designs: a Case of Study Ms. Bruna Fernandes Flesch, Dr. Rodrigo Marques de Figueiredo, Dr. Lúcio Rene Prade (UNISINOS/ Brazil) |
O2-15 Optimization of Cu Interconnects – SiCN Interfacial Adhesion by Surface Treatments Mr. Dong Jun Kim*, Dr. Sumin Kang*, Mr. Sun Woo Lee*, Dr. Inhwa Lee, Dr. Seungju Park, Dr. Jun Soo Lee, Dr. Jihyun Lee, Dr. Joong Jung Kim, Prof. Taek-Soo Kim (Samsung Electronics, KAIST*/ Korea) |
| 18:00-18:20 | Award Ceremony, Lucky Draw and Closing Remark (Room Monterosso, B1F) | |
※ General Meeting: Nov.4, 2021 (Thur.) PM5:40, Room Monterosso (B1F)