ISMP 2021 is the 19th International Symposium on Microelectronics and Packaging. ISMP is the top-tier international event that brings together the expertise in electronics packaging and microelectronic systems from academia to industry. This year, the conference is held to provide a bigger chance to exchange ideas and experiences fromNovember 3(Wed.) to 5(Fri.), 2021 at Hanwha Resort, Busan, Korea.
As the conference site, Busan is the second-largest city in Korea and famous for tourist and shopping attractions as well as its astounding variety of fresh seafood. You will not forget the vibrant marketplace experience and the exceptional hospitality of Busan.
We look forward to seeing you in Busan at the ISMP 2021.

Title The 19th International Symposium on Microelectronics and Packaging
Event Type Hybrid (both onsite face-to-face and online sessions) Symposium
Date November 3(Wed.) to 5(Fri.), 2021
Venue Hanwha Resort, Busan, Korea
Host Korea Microelectronics and Package Society
Program Welcome Reception, Plenary/ Keynote/ Invited/ Oral/ Poster Presentation and Banquet
Website http://ismp2021.org/
Offcial Language English
Key Dates
Abstract submission August 31, 2021
Acceptance notification September 21, 2021
Pre-registration October 25, 2021
Manuscript submission December 31, 2021
Secretariat KMEPS (Korea Microelectronics and Packaging Society)
4F, 74, Dongjak-daero, Seocho-gu, Seoul, 06676, Korea
Tel.: +82-2-538-0962
E-mail : kmeps@ismp2021.org
Publication Policy

The selected full manuscripts are going to be published in MDPI Coatings (ISSN 2079-6412) 2022 after the ISMP 2021.