Full Paper must be written clearly in English, and submitted prior to December 31, 2021. Authors may further edit and modify submitted abstracts until the submission deadline.
Acknowledgment of your submission will be sent to the e-mail address provided by the main author. Please make sure that you receive an e-mail confirmation after making your submission. If you do not receive this e-mail confirmation, it means we have not received your Paper.
※ MDPI Coatings(ISSN 2079-6412) Journal Submission Guideline
– In the case of MDPI Coatings, corresponding authors must submit their contributions directly to the MDPI website.
– If a person who has presented through ISMP2021 wishes to submit a contribution, please inform(Name, Affiliation, Paper title, …) us of their wishes before submitting it, and our journal editor of MDPI Coatings will provide information to MDPI about those who wish to submit.
– Probably a discount of publication fee is possible for a corresponding author with high h-index.
Please indicate whether you want to submit MDPI journal before submitting a full paper to our society.
All submitted paper will be reviewed by the Program Committee according to standard review procedures. Notification of acceptance will be sent via e-mail by February 28, 2022.
| – MDPI Coatings (ISSN 2079-6412: IF=2.881) | Coatings Template |
| – Microelectronics Reliability (Coming Soon!) | |
| – Journal of Advanced Joining Processes (Composite Solder Joints) * Submit your paper before November 30, 2021 via the paper system. https://www.editorialmanager.com/jajp/default.aspx Please select Article Type as VSI: Composite solder joints, then the paper will be run in my process. |
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| – KMEPS (The Korean Microelectronics and Packaging Society) Submit your paper before November 30, 2021 via e-mail(kmeps@kmeps.or.kr). |
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※ It will be updated whenever journals are added.